Roberto Jr Ortines Pacina
Staff Engineer – Process Integration
Batam
Summary
Experienced Process Integration Engineer and Project Manager with a demonstrated history of working in the semiconductor manufacturing for 20 years. Highly developed technical competency in process engineering for End-of-line process and PMD certified project manager for new product, process and package introduction and change management.
Overview
21
21
years of professional experience
2
2
Languages
Work History
Staff Process Integration Engineer
PT Infineon Technologies Batam
11.2021 - Current
- Provide efficient and effective in-process problem investigation, defect and yield analysis, containment actions and controls to prevent problem occurrence in all phases of assembly operations during new package ramp up through DMAIC and 8D approach.
- Support on yield improvements and process optimization on existing package and process through DOE study and poke yoke improvement actions.
- Drive the team in generation of Failure Mode and Effect Analysis (FMEA) to identify the potential risk and key activities for new product and process change implementation.
- Support yield improvements and process optimization on existing package and process through DOE study and poke yoke improvement actions.
- Drive to resolve the chronic unremoved airvent flash issue in DSO 12 package through modification of bottom cavity bar by increasing the airvent opening.
- Resolve the unremoved dambar defect for tiebarless package through design modification by adding a notch at cutting plate at middle of dambar-slug side and leadframe-slug side. Design was submitted for Patent under 2023E01746 ID.
- Qualified alternative materials and suppliers to reduce costs while maintaining product quality.
- Lead in the equipment qualification and buy-off of ASM Mphenix Tiebarless Singulation.
- Work with Development Team for the hand over of the POR (Process of Records) and ensure all KPIs are achieved in a manufacturing corridor.
- Drove resolution of chronic unremoved airvent flash issue in DSO 12 package by modifying bottom cavity bar to increase airvent opening.
- Qualify alternative material/supplier that will provide lower cost without affecting the product quality.
- Initiate NLOP (Next Level of Productivity) projects to support cost reduction programs.
- Conducted root cause analyses to identify underlying issues contributing to process variability, enabling targeted corrective actions that improved overall stability.
- Conducted root cause analyses to identify issues affecting process variability, enabling targeted corrective actions that enhanced overall stability.
- Presented regular progress updates on key projects at management meetings, providing clear insights into project status while aligning stakeholders on strategic objectives.
- Collaborated with other engineers to design and implement innovative solutions for complex manufacturing challenges.
Ramp up Manager (Project Manager)
PT Infineon Technologies Batam
02.2013 - 11.2021
- Plan, execute and implement Change Management projects for cost savings, risk management and quality improvement to meet project objectives within timeframe and budgetary constraints.
- Generate project proposal, qualification summary, and implementation plan and present to Process Change Review Board for Change Management milestone release.
- Generate and present Business Case to the management with calculation of cost savings and benefits, project cost and return of investment for budget approval.
- Managed daily activities, monitored project schedule, identified risks, resolved issues, and motivated team members to ensure timely completion of milestone deliverables.
- Led ramp-up of large strip size implementation on DSO 300mils, DSO 430mils, and DSO 12mils packages, achieving project objectives.
- Spearhead in the introduction and ramp up of NiPd leadframe in DSO 300mils package.
- Led ramp-up efforts for DSO150mils (PG-TSDSO-14/24) at Infineon Batam.
- Lead in the production and ramp up of new product and package such as EiceDRIVER Enhanced DSO 20-91 U5886A, PG-DSO 20-88 S1941A (Tetris).
- Oversaw production and ramp-up of GaN and SiC devices.
- Qualified and ramped up second source supplier for lead frame and for 30um and 50um copper.
- Initiated the 4M’s readiness checklist per assembly process to ensure that all requirements are covered prior safe-launch monitoring.
Manufacturing Engineer/ Process Integration Engineer
PT Infineon Technologies Batam
01.2012 - 02.2013
- Enhanced assembly capability for new packages and processes.
- Executed engineering sample builds in collaboration with cross-functional teams.
- Upgrade the current process capability and improve assembly productivity for new packages ramp up.
- Proposed innovative solutions for reliability and processability improvements.
- Execute Engineering Sample builds
- Generates, reviews and interprets process specifications and other related documents.
- Extend support in the analysis, investigation, containment and control of functional, electrical test and reliability failures.
- Standardize wafer saw blade from four (4) types to two (2) types.
Process Engineer III – Mold Process
Amkor Technology Philippines, Inc.
05.2005 - 01.2012
- Drives and generates programs geared toward improvement in cost, productivity and quality for manufacturing needs.
- Addresses all customers’ molding/marking quality issues and formulates appropriate corrective and preventive actions. Provides high level of responsiveness to customer concerns.
- Ensures adherence to customer standards and recommends actions like stopping production and hold shipment if necessary to contain and correct quality problems.
- Troubleshoots problems in manufacturing lines and responds to customer complaints on technical matters.
- Generates and reviews process documents such as specifications, control plans, standrol plans, FMEA and work instructions to be used and implemented in the production.
- Review and improve existing engineering documents, specifications, and process controls.
- Generates improvement plan and actions for yield and DPM reduction.
- Monitors assembly yield performance and lot rejection analysis.
- Validate/evaluate/qualify tools, parts, and alternative manufacturing solutions.
- Developed improvement plans and actions that enhanced yield and reduced DPM.
- Resolved customers’ molding/marking quality issues by formulating corrective and preventive actions, ensuring timely responses to customer concerns.
- Reduced package voids reject occurrence for MQFP 28x28 package through the use of MCpS.
- Implemented copper-free mold tool cleaning methodology through the use of brass leadframe for cost reduction project.
- Implemented the molding compound floor life extension from 96hours to 120hours for G700 series molding compound.
- Implemented copper-free mold tool cleaning methodology using brass leadframe, contributing to cost reduction efforts.
- Lead in the major customers audit and certification.
- Implemented the molding compound floor life extension from 96hours to 120hours for G700 series molding compound.
Education
Bachelor of Science - Electronics and Communication Engineering
Technological University of the Philippines- Visayas
Talisay, Negros Occidental04-2004
Skills
- Process optimization
- Process Optimization
- Statistical analysis proficiency
- Process troubleshooting
- Materials characterization
- Electrical testing
- PME and PMD Certified Familiar with Project Office
- Effective communication skills
Timeline
Staff Process Integration Engineer
PT Infineon Technologies Batam
11.2021 - Current
Ramp up Manager (Project Manager)
PT Infineon Technologies Batam
02.2013 - 11.2021
Manufacturing Engineer/ Process Integration Engineer
PT Infineon Technologies Batam
01.2012 - 02.2013
Process Engineer III – Mold Process
Amkor Technology Philippines, Inc.
05.2005 - 01.2012
Bachelor of Science - Electronics and Communication Engineering
Technological University of the Philippines- Visayas